IEC 60749-19 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 19: Die shear strength
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
Product Details
Edition:
1.0
Published:
02/13/2003
Number of Pages:
11
File Size:
1 file , 200 KB
Note:
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