IEC 60749-15 Ed. 2.0 b:2010
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Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
standard by International Electrotechnical Commission, 10/28/2010
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
– editorial change in the scope;
– addition of lead-free solder chemical composition specification.
Product Details
- Edition:
- 2.0
- Published:
- 10/28/2010
- Number of Pages:
- 14
- File Size:
- 1 file , 430 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
