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Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies standard by International Electrotechnical Commission, 08/28/1998
Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
Product Details
Edition:
1.0
Published:
08/28/1998
Number of Pages:
49
File Size:
1 file , 570 KB
Note:
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