IEC 63011-1 Ed. 1.0 b

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Integrated circuits – Three dimensional integrated circuits – Part 1: Terminology

Published by Publication Date Number of Pages
IEC 11/28/2018 24
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IEC 63011-1 Ed. 1.0 b – Integrated circuits – Three dimensional integrated circuits – Part 1: Terminology

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Product Details

Edition:
1.0
Published:
11/28/2018
Number of Pages:
24
File Size:
1 file , 1.3 MB
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