JIS Z 3285
Original price was: $87.00.$52.00Current price is: $52.00.
Solder paste for micro-joining — Characteristic test methods for solder paste using fine particles
standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/2017
JIS Z 3285 – Solder paste for micro-joining — Characteristic test methods for solder paste using fine particles
JIS Z 3285:2017 specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1 (hereafter referred to as solder paste), mainly intended for connection of wiring and components to high-density printed circuit boards with fine wiring (e.g. 60 µm or smaller in minimum conductor width and minimum conductor spacing) used in electronic and communication devices. The test methods specified in this Standard incorporate consideration for the effect of high surface activity of fine solder particles, so that such solder particles can be tested with better precision than when tested using the test methods specified in JIS Z 3284 series.
Product Details
- Published:
- 01/01/2017
- Number of Pages:
- 26
- File Size:
- 1 file , 1.3 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
