IPC 3408 – General Requirements for Anisotropically Conductive Adhesives Films
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
Product Details
Published:
11/01/1996
Number of Pages:
32
File Size:
1 file , 480 KB
Product Code(s):
3408(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
