IPC 9501 – PWB Assembly Process Simulation for Evaluation of Electronic Components
Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials.
Product Details
Published:
07/10/1995
Number of Pages:
12
File Size:
1 file , 180 KB
Part of:
IPC M109, IPC 9500-K
Product Code(s):
9501(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
