IPC 9504

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Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

Published by Publication Date Number of Pages
IPC 06/01/1998 27
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IPC 9504 – Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.

Product Details

Published:
06/01/1998
ANSI:
ANSI Approved
Number of Pages:
27
File Size:
1 file , 200 KB
Part of:
IPC M109, IPC 9500-K
Product Code(s):
9504(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus