IPC 9701B – Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
Product Details
Published:
02/01/2022
ISBN(s):
9781638160724
Number of Pages:
24
File Size:
1 file , 1 MB
Product Code(s):
9701-STD-0-D-0-EN-B, 9701-STD-0-D-0-EN-B
Note:
This product is unavailable in Russia, Ukraine, Belarus
